发明名称 |
Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
摘要 |
A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing. |
申请公布号 |
EP2112450(A1) |
申请公布日期 |
2009.10.28 |
申请号 |
EP20080008028 |
申请日期 |
2008.04.25 |
申请人 |
GOLDEN SUN NEWS TECHNIQUES CO., LTD.;CPUMATE INC. |
发明人 |
LIN, KUO-LEN;LIU, WEN-JUNG;CHENG, CHIH-HUNG;HSU, KEN |
分类号 |
F28D15/02;H01L23/427;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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