| 摘要 |
PURPOSE: A lead frame for the high power light-emitting diode package capable of arranging the diode chips and a high power light-emitting diode package using the same are provided to enhance the reliability of products by exposing the portion of the lead frame adjacent to the substrate. CONSTITUTION: A lead frame for the high power light-emitting diode package capable of arranging the diode chips includes chip connection terminals(14,15,16), dissimilar chip connection terminals(34,35,36), and medium present terminals(21,22,23). The medium terminal has the constant area which is electrically independent from the chip connection terminal between the chip connection terminal and another chip connection terminal. The medium terminal includes the insulation part and the heat transfer part. The heat transfer part is formed for the heat dissipation and is closely located with the substrate. |
