发明名称 |
Method of manufacturing semiconductor device and method of treating electrical connection section |
摘要 |
A method of manufacturing a semiconductor device includes: applying a paste containing acid to an electrical connection section which is electrically connected with a semiconductor substrate; removing the paste from the electrical connection section by washing the electrical connection section; and providing a conductive material to the electrical connection section.
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申请公布号 |
US7608479(B2) |
申请公布日期 |
2009.10.27 |
申请号 |
US20060332262 |
申请日期 |
2006.01.17 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
NAKAYAMA HIROHISA;SATO SHIRO;SHOJI MASANOBU;NOSAKA HITOSHI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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