| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin which does not contain a low-molecular silicone which may cause an adverse effect to an electric appliance and is excellent in defoamability at the time of sticking when it is processed into an adhesive film. SOLUTION: The curable resin is obtained by allowing a compound having a functional group capable of reacting with an isocyanate group and a reactive silicon group to react with a prepolymer obtained by allowing a polyvalent isocyanate compound to react with a polyester polyol. The ratio of the isocyanate group of the polyvalent isocyanate to the hydroxy group of the polyol is preferably 1 to 2. Further, in the compound having a functional group capable of reacting with an isocyanate group and a reactive silicon group, the functional group capable of reacting with an isocyanate group is preferably amine, and the reactive silicon group which is moisture-curable is preferably a trimethoxysilyl group or a triethoxysilyl group. The compound preferably has 2 or more reactive silicon groups. COPYRIGHT: (C)2010,JPO&INPIT |
