发明名称 |
PACKAGE-BASE STRUCTURE OF LUMINESCENT DIODE AND FABRICATING PROCESS THEREOF |
摘要 |
A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.
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申请公布号 |
US2009261375(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
US20090428342 |
申请日期 |
2009.04.22 |
申请人 |
SILICON BASE DEVELOPMENT INC. |
发明人 |
CHEN CHIH-MING;HWANG DENG-HUEI;CHENG CHING-CHI |
分类号 |
G03F7/20;H01L21/768;H01L33/48;H01L33/62;H01L33/64 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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