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发明名称
Board On Chip semiconductor package substrate formed with solder resist dam and manufacturing method thereof
摘要
申请公布号
KR100922714(B1)
申请公布日期
2009.10.22
申请号
KR20070116424
申请日期
2007.11.15
申请人
发明人
分类号
H01L23/48;H01L21/027;H01L21/60
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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