发明名称 MANUFACTURING METHOD OF CONDUCTIVE SUBSTRATE, AND CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive substrate in which the conductive substrate comprising a treating body with a multilayer structure having a high adhesion of the multilayer structure and the treating body (substrate), superior tear and wear resistance and peeling resistance as well as excellent conductivity can be manufactured efficiently. SOLUTION: In the manufacturing method, by using a belt-shape treating body 11, the treating body is made to pass a first liquid tank 23 (B process) filled with an aqueous solution 24 of a negative electrode polymer and a fifth liquid tank 31 (C process) filled with an aqueous solution 32 of a positive electrode polymer, thereby, a first electrostatic charge film having positive charges and a second electrostatic charge film having negative charges can be continuously film-formed on the treating body 11. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009238459(A) 申请公布日期 2009.10.15
申请号 JP20080080648 申请日期 2008.03.26
申请人 FUJIKURA LTD;SNT CO 发明人 ONO AKINOBU;OMORI KIWAKO;SHIRATORI TOKIAKI;KIN SHIZUHIRO;FUJIMOTO KOJI
分类号 H01B13/00 主分类号 H01B13/00
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