| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring forming device capable of forming a high-quality wiring pattern with high conductivity at a low cost for various kinds of substrates. Ž<P>SOLUTION: The wiring forming device has: a first ink jet recording head for ejecting a silver halide emulsion onto at least one surface side of a substrate in accordance with a wiring pattern; a pattern forming section for patterning the silver halide emulsion on at least the one surface side of the substrate and forming a patterned emulsion layer made of the silver halide emulsion; an exposure section for exposing the patterned emulsion layer formed by the first ink jet recording head; and a development processing section for performing development processing for the patterned emulsion layer exposed by the exposing section and forming a patterned conductive silver layer as the wiring pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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