| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent position displacement occurring in mounting a solid-state image sensor on a wiring board while suppressing bowing and twisting of the image sensor. <P>SOLUTION: The solid-state image sensor has a plurality of outer leads 102, wherein each of the outer leads 102 includes: a horizontal portion LF protruding in the horizontal direction from a side face of a package body 101 in which the solid-state image sensor chip is housed; an end portion LT extending in the direction normal to the horizontal portion LF and disposed right below the horizontal portion LF; a mid portion LC positioned between the horizontal portion LF and the end portion LT; a first bending portion K1 formed between the horizontal portion LF and the mid portion LC; and a second bending portion K2 formed between the mid portion LC and the end portion LT. <P>COPYRIGHT: (C)2010,JPO&INPIT |
