发明名称 APPARATUS AND METHOD FOR APPLYING A FILM ON A SUBSTRATE
摘要 A system that incorporates teachings of the present disclosure may include, for example, an apparatus having a plurality of applicators, each applicator with an ingress opening to receive a liquid, and an egress opening to release the liquid, and a conductor positioned in a conduit of each of the plurality of applicators, the conductor and the conduit having dimensions to cause a surface tension of the liquid to prevent a constant flow of the liquid from the egress opening. Each conductor of the plurality of applicators can be coupled to one of one or more power sources operable to apply a charge to the liquid to overcome the surface tension and form at the egress opening of each applicator a plurality of jet sprays of the liquid applicable on a substrate to form a thin film. Additional embodiments are disclosed.
申请公布号 US2009258153(A1) 申请公布日期 2009.10.15
申请号 US20090421676 申请日期 2009.04.10
申请人 THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS 发明人 KIM KYEKYOON;CHOI HYUNGSOO
分类号 B05B5/025 主分类号 B05B5/025
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