发明名称 |
METHOD FOR PRODUCING SEMICONDUCTOR CHIPS AND CORRESPONDING SEMICONDUCTOR CHIP |
摘要 |
The invention relates to method for producing a plurality of semiconductor chips (1). A plurality of semiconductor elements (2) is made available on a substrate (8), the semiconductor elements (2) being interspaced by gaps (25). A structured carrier (33) is made available and comprises a plurality of elevations (35). The structured carrier (33) is positioned relative to the substrate (8) in such a manner that the elevations of the structured carrier (33) extend into the gaps (25) between the semiconductor elements (2), thereby producing a mechanically stable composite (38) which comprises the substrate (8) and the structured carrier (33). The composite (38) is subdivided into a plurality of semiconductor chips (1). The invention further relates to a semiconductor chip. |
申请公布号 |
WO2009079982(A3) |
申请公布日期 |
2009.10.15 |
申请号 |
WO2008DE02056 |
申请日期 |
2008.12.08 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;ILLEK, STEFAN |
发明人 |
ILLEK, STEFAN |
分类号 |
H01L21/68;H01L21/50;H01L21/58;H01L21/60;H01S5/02;H01S5/10 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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