| 发明名称 |
Solder composition |
| 摘要 |
A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weight of from 100 to 200 g/mol.
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| 申请公布号 |
US7601228(B2) |
申请公布日期 |
2009.10.13 |
| 申请号 |
US20040482056 |
申请日期 |
2004.10.08 |
| 申请人 |
FUJI ELECTRIC HOLDINGS CO., LTD |
发明人 |
NISHINA TSUTOMU;OKAMOTO KENJI |
| 分类号 |
B23K35/34;B23K35/363;B23K35/02;B23K35/14;B23K35/22;B23K35/26;B23K35/36;H05K3/34 |
主分类号 |
B23K35/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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