| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board of which the cost is suppressed, a multilayer wiring board unit constituted by mounting electronic components on such a multilayer wiring board, and to provide an electronic device which has such multilayer wiring board unit built therein. SOLUTION: A multilayer wiring board 300 includes a two-layer-skip via 350, in a shape of recesses along an inner surface, constituted of a conductor covering the inner surface of a hole, penetrating through insulating layers for three layers and having a bottom on a wiring layer 312 of a surface 300a side of a core layer 310, from a wiring layer 322 of the surface 300a side; and a three-layer-skip via 360 in the shape of recess along the inner surface composed of a conductor covering the inner surface, penetrating through insulating layers for four layers reaching the wiring layer 312 of the surface 300a side of the core layer 310, from a wiring layer 322 of a back surface side 300b and having a bottom whose position mates the bottom of the hole, corresponding to the two-layer-skip via 350 in the wiring layer 312 of the surface side 300a of the core layer 310. COPYRIGHT: (C)2010,JPO&INPIT |
