发明名称 SILICON CARBIDE WAFER
摘要 PROBLEM TO BE SOLVED: To provide a silicon carbide wafer, can significantly enhance the reverse breakdown voltage, when it is applied to a Schottky barrier diode (SBD). SOLUTION: In the silicon carbide wafer, obtained by allowing the epitaxial film of a cubic silicon carbide on the surface of a cubic silicon carbide substrate, the concentration of the dopant contained in the epitaxial film is made to be equal to or lower than 3×10<SP>15</SP>atoms/cm<SP>3</SP>, the thickness of the epitaxial film is set to 20μm or larger, and the surface roughness of the epitaxial film is set to 3 nm or smaller by arithmetic mean roughness (Ra), in a region which is 10 squareμm. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009231438(A) 申请公布日期 2009.10.08
申请号 JP20080073375 申请日期 2008.03.21
申请人 SUMCO CORP 发明人 ASAYAMA HIDEKAZU;IKEDA NAOKI;FUSEGAWA KAZUHIRO
分类号 H01L29/47;H01L29/872 主分类号 H01L29/47
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