| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an evaluation method for evaluating the wettability of solder to an electrode terminal at a chip electronic parts, according to a criterion based on behavior of the chip electronic parts in packaging. <P>SOLUTION: The method for evaluating the chip electronic parts, comprising the processes of: a process for preparing a substrate comprising a pair of land patterns; an application process for applying soldering paste to the land patterns; a process for preparing a chip electronic parts comprising a pair of electrode portions; an installation process for installing the chip electronic parts at a predetermined position different from a reference position on the substrate after the application process; a melting process for heating the substrate to melt the soldering paste applied to the land patterns after the installation process; and a measuring process for measuring the position of the chip electronic parts after the melting process. <P>COPYRIGHT: (C)2010,JPO&INPIT |
