发明名称 |
METHOD OF MANUFACTURING MULTILAYER WIRING BOARD, AND INTERMEDIATE PRODUCT OF MULTILAYER WIRING BOARD, |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board that lowers manufacturing cost. SOLUTION: A coreless wiring board as the multilayer wiring board does not have a core substrate, and has a build-up layer 20 which is multilayered by stacking conductor layers 26 and resin insulating layers 21 to 24 alternately. An intermediate product 100 of the coreless wiring board has a stack metal sheet body 42 formed by stacking two pieces of copper foil 42a and 42b formed of a conductive metal material and bringing them into contact with each other in a peelable state. The conductor layers 26 and the resin insulating layers 21 to 24 are stacked alternately on both surfaces of the stack metal sheet body 42 to form the build-up layer 20. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009224415(A) |
申请公布日期 |
2009.10.01 |
申请号 |
JP20080064986 |
申请日期 |
2008.03.13 |
申请人 |
NGK SPARK PLUG CO LTD |
发明人 |
KATAGIRI HIROYUKI;ASANO TOSHIYA |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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