A lead frame having a rigid reinforcing part formed by connecting adjoining inner leads to each other with a resin. The lead frame is characterized in that the rigid reinforcing part is one formed by applying a thermosetting resin or ultraviolet-curable resin to an area to be resin-coated, thereby filling the gaps between the inner leads with the resin, and curing the resin and that the spaces between the adjoining inner leads are parallel or become wider from the resin-coated area toward the die-pad-side ends of the inner leads. Due to such constitution, the resin liquid applied to the area to be resin-coated does not spread toward the ends, whereby the distance between the rigid reinforcing part formed by curing the resin and the ends can be made even. The ends of the inner leads hence have even rigidity.
