发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device that is improved in cooling capability while reducing pressure loss of a cooling medium. SOLUTION: Partition plates 20-1 and 20-2 connecting upstream cooling fins 14 and downstream cooling fins 15 form communication flow passages 18 making upstream cooling medium flow passages 16 and downstream cooling medium flow passages 17 communicate with each other between a reverse surface 12b of a cooling plate 12 and the partition plates 20-1 and 20-2. A pair of partition plates 20-1 and 20-2 which gradually increase in interval from an upstream cooling fin 14 to a downstream cooling fin 15 is coupled to the upstream cooling fin 14, and the pair of partition plates 20-1 and 20-2 which gradually increase in interval from a downstream cooling fin 15 to an upstream cooling fin 14 is coupled to the downstream cooling fin 15. The upstream cooling fin 14 to which the pair of partition plates 20-1 and 20-2 are coupled gradually decreases in thickness from the upstream side to the downstream side of a cooling medium flow. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009224557(A) 申请公布日期 2009.10.01
申请号 JP20080067345 申请日期 2008.03.17
申请人 TOYOTA CENTRAL R&D LABS INC 发明人 MOCHIZUKI MIYO;KANEDA KENJI;YAMANAKA GENTARO
分类号 H01L23/473 主分类号 H01L23/473
代理机构 代理人
主权项
地址