发明名称 PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a probe card that stably secures electric connection between a circuit board and a probe board even if the boards are affected by thermal deformation or thermal displacement, and sufficiently maintains the plane parallelism of a probe group tip; and to provide a method thereof. Ž<P>SOLUTION: This probe card includes the circuit board having first connection terminals arranged on the lower surface, the probe board where second connection terminals corresponding to respective first connection terminals are arranged on the upper surface and a plurality of probes are arranged on the lower surface, and a plurality of relay connection pins that are attached to the first connection terminals and come into contact with the second connection terminals to electrically interconnect them. An electrically connectable anisotropic electric conduction sheet is interposed between the relay connection pins attached to the first connection terminals and the second connection terminals, and respective surfaces of the anisotropic electric conduction sheet are fixed to the tips of the relay connection pins and the probe board including the second connection terminals. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009222680(A) 申请公布日期 2009.10.01
申请号 JP20080070353 申请日期 2008.03.18
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 FURUSAKI SHINICHIRO
分类号 G01R1/073;H01L21/66 主分类号 G01R1/073
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