| 摘要 |
<p>Provided is a method for manufacturing a wiring board wherein a via hole can be bored without enlarging the diameter more than required, fine wiring is facilitated, and connection reliability of via and wiring can be enhanced. A first resin layer (4) in a cured-state in which a first bottomed via hole (4a) having a conductor pattern (2a) as a bottom is prepared, the first via hole is filled with conductive paste (5) which is then cured, and then the surface of the conductive paste (5) is polished. A second resin layer (6) in a non-cured state having a second through via hole (6a) formed at a position corresponding to the first via hole is laminated on the first resin layer (4) such that the first and second via holes continue. The second via hole (6a) is filled with conductive paste (7), a metal foil (8) is pressed thereon, and then the conductive paste (7) and the second resin layer (6) are cured simultaneously.</p> |
