| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of reducing product cost, saving maintenance power, and promoting the shortening of time. Ž<P>SOLUTION: The substrate treatment apparatus comprises: a treatment chamber 11 for treating a substrate W treated by a plurality of gases; a gas introduction section 12 for introducing the plurality of gases into the treatment chamber 11 while the gas introduction section 12 is provided in the treatment chamber 11; and an inlet block 13 that is arranged on the treatment chamber 11 and has a plurality of gas channels 13b for guiding the plurality of gases from a gas supply mechanism 14 to the gas introduction section and a heater 23 for heating gas flowing in at least one of the gas channels. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
