发明名称 A PART SOLDERING METHOD FOR BATTERY PACK'S PCB
摘要 PURPOSE: A part soldering method for a battery pack PCB is provided to seal a gap between parts and a printed circuit board through a sealing agent, thereby preventing infiltration of foreign substances during a battery pack molding process. CONSTITUTION: A part soldering method for a battery pack PCB comprises the following steps. A printed circuit board is supplied on an SMT through a loader. A solder paste is printed on the printed circuit board. A sealing agent is printed on a part mounting part of the printed circuit board through a sealing jig. A part is mounted on the sealing agent printed part of the printed circuit board. The part mounted on the printed circuit board is soldered through reflow.
申请公布号 KR20090102572(A) 申请公布日期 2009.09.30
申请号 KR20080028096 申请日期 2008.03.26
申请人 NEXCON TEC CO., LTD. 发明人 KIM, DAE SEUNG;LEE, YOUNG HO;UM, TAE JIN
分类号 H05K3/40 主分类号 H05K3/40
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