发明名称 |
A PART SOLDERING METHOD FOR BATTERY PACK'S PCB |
摘要 |
PURPOSE: A part soldering method for a battery pack PCB is provided to seal a gap between parts and a printed circuit board through a sealing agent, thereby preventing infiltration of foreign substances during a battery pack molding process. CONSTITUTION: A part soldering method for a battery pack PCB comprises the following steps. A printed circuit board is supplied on an SMT through a loader. A solder paste is printed on the printed circuit board. A sealing agent is printed on a part mounting part of the printed circuit board through a sealing jig. A part is mounted on the sealing agent printed part of the printed circuit board. The part mounted on the printed circuit board is soldered through reflow.
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申请公布号 |
KR20090102572(A) |
申请公布日期 |
2009.09.30 |
申请号 |
KR20080028096 |
申请日期 |
2008.03.26 |
申请人 |
NEXCON TEC CO., LTD. |
发明人 |
KIM, DAE SEUNG;LEE, YOUNG HO;UM, TAE JIN |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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