| 摘要 |
PURPOSE: A wafer processing method and wafer processing apparatus are provided to reduce the surface roughness of a wafer and to improve the gettering effect. CONSTITUTION: Devices are formed on the front side of the wafer(20). The wafer is griped to expose the rear side of a wafer. The rear side of a wafer is grinded to form the cracking layer on the rear side. The rear side of a wafer is polished to leave the cracking layer partially. In the polishing step, the outermost layer of the rear side of a wafer is removed.
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