| 摘要 |
PURPOSE: A method for picking up a semiconductor device is provided to prevent the damage of the semiconductor device when picking up the plurality of semiconductor devices in two trays. CONSTITUTION: A tray for pickup is determined according to the order of the tray. Semiconductor devices are picked up as many as the semiconductor device according to the loading groove order from the tray. The number of the semiconductor devices remaining in the tray is compared with the number of the semiconductor device which are picked up at the same time(S200). If the number of the semiconductor devices remaining in the tray is lower than the number of the semiconductor device which are picked up at the same time. The pickup order about the semiconductor device remaining in the tray and the semiconductor device to be picked up in the following tray is determined. The semiconductor device is picked up according to the determined pickup order(S500).
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