Semiconductor device and manufacturing method thereof

摘要

The semiconductor device includes a first semiconductor chip having first electrodes on a fringe region of a main surface thereof, and a second semiconductor chip smaller in area than the first semiconductor chip and having second electrodes on a main surface thereof. The first semiconductor chip and the second semiconductor chip are connected together by bonding a surface of the second semiconductor chip that is opposite to the main surface thereof to a region of the main surface of the first semiconductor chip other than the fringe region. The first electrodes are connected to the second electrodes by wirings formed over the main surface of the first semiconductor chip, a side surface of the second semiconductor chip and the main surface of the second semiconductor chip.