发明名称 Connection between a conductive substrate and a laminate
摘要 A connection (1) is provided between a conductive substrate, in the form of a planar aluminium terminal (2), and a laminate (3). The laminate has a first plastics layer, in the form of a polymer layer (4), that is secured to terminal (2) and a conductive aluminium layer (5) disposed outwardly from and adjacent to layer (4). The layers (4, 5) terminate at a common circular edge (6) that defines an opening (7) that overlies terminal (2). The connection (1) includes an insulator in the form of a grommet (8) that extends over edge (6) for electrically insulating layer (5) from terminal (2).
申请公布号 US7595131(B2) 申请公布日期 2009.09.29
申请号 US20030433860 申请日期 2003.11.12
申请人 发明人 JAMES DAVID ALBERT;STEPHENS RICHARD MICHAEL;SLOAN ALINA KAY
分类号 H01G4/224;H01M2/30;B32B27/00;H01G9/08;H01G9/10;H01G9/155;H01M2/02;H01M2/06;H01M2/08;H01M2/10;H01M2/26;H01M4/66;H01M8/02;H01M8/08;H05K1/14 主分类号 H01G4/224
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