发明名称 THERMO VALVE AND HEAT MEDIUM CIRCUIT INCLUDING SAME
摘要 <p>Provided are a thermo valve with a simple, low-cost, lightweight, and compact structure capable of optimally controlling the flow of a heat medium while achieving a low pressure loss and a heat medium circuit including the thermo valve. A thermo valve (1, 100, 200, 300) installed in a heat medium circuit in which a heat medium flows comprises a valve element that is operated in a direction along the flow of the heat medium, and a temperature sensitive movable portion (2) for driving opening/closing of the valve element in the direction along the flow of the heat medium by using a thermally actuated operation corresponding to the temperature of the heat medium, and controls the flow of the heat medium according to the temperature of the heat medium. The valve element is constituted of a coil spring valve element (3, 103, 203, 230, 303) that is opened/closed by an increase/decrease in the passage section of a flow path of the heat medium caused by the change of gaps in a winding portion that expands and contracts in response to the thermally actuated operation of the temperature sensitive movable portion (2).</p>
申请公布号 WO2009116254(A1) 申请公布日期 2009.09.24
申请号 WO2009JP01128 申请日期 2009.03.13
申请人 FUJI BELLOWS CO., LTD.;COREA ELECTRONICS CORPORATION;PARK, HEE WAN;SUZUKI, TAKATOMO;TAKAHASHI, KEN 发明人 PARK, HEE WAN;SUZUKI, TAKATOMO;TAKAHASHI, KEN
分类号 F16K31/68;F01P7/16;F16K13/00 主分类号 F16K31/68
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