| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connector capable of reducing poor contact, even if deformation of a mating object to be connected takes place. <P>SOLUTION: To an insulating member 7, wherein the member 7 is disposed between a semiconductor package 21, and an evaluation board 222, many elastically deformable conductive members 5 are provided for conducting the semiconductor package 21 and the evaluation board 222, and further, a spacer 9 for adjusting the distance between the semiconductor package 21 and the evaluation board 222 is movably, in the direction of thickness of the insulating member 7. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
