发明名称 |
METHOD OF CUTTING OUT CHIPS FOR A PLURALITY OF SENSOR ELEMENTS FROM LAMINATED BODY, METHOD OF MANUFACTURING SENSOR ELEMENT, AND SENSOR ELEMENT |
摘要 |
A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
|
申请公布号 |
US2009239053(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20090406171 |
申请日期 |
2009.03.18 |
申请人 |
NGK INSULATORS, LTD.;NGK PRINTER CERAMICS CO., LTD. |
发明人 |
SHINDO HIROYUKI;ASAI TOYOHIKO |
分类号 |
B32B7/02;B26D1/00;C04B35/00 |
主分类号 |
B32B7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|