发明名称 METHOD OF CUTTING OUT CHIPS FOR A PLURALITY OF SENSOR ELEMENTS FROM LAMINATED BODY, METHOD OF MANUFACTURING SENSOR ELEMENT, AND SENSOR ELEMENT
摘要 A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
申请公布号 US2009239053(A1) 申请公布日期 2009.09.24
申请号 US20090406171 申请日期 2009.03.18
申请人 NGK INSULATORS, LTD.;NGK PRINTER CERAMICS CO., LTD. 发明人 SHINDO HIROYUKI;ASAI TOYOHIKO
分类号 B32B7/02;B26D1/00;C04B35/00 主分类号 B32B7/02
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