| 摘要 |
This application discloses a thin-film deposition apparatus comprising a vacuum chamber and a partition separating the inside of the vacuum chamber into two areas. A substrate is capable of passing through an inside opening provided in the partition. The inside opening is closed by a valve. A thin film is deposited onto the substrate in the first area. The substrate is heated by a heater in the second area prior to the deposition. The substrate is held by a holder in point contact while heated. A boosting-gas is introduced into the second area during the heating, thereby increasing pressure up to a viscous flow range. A pumping line evacuates the first area at a vacuum pressure all the time. The pumping line also evacuates the introduced boosting-gas from the second area to make the second area at a vacuum pressure when the valve is opened.
|
