CHIP STRUCTURE AND STACKED CHIP PACKAGE AS WELL AS METHOD FOR MANUFACTURING CHIP STRUCTURES

摘要

A chip structure according to the present invention is provided. A plurality of pedestals extends from the back surface of the chip structure. Each of the pedestals is located at a position away from the edge of the back surface for a non-zero distance so that the pedestals of an upper chip structure will not damage the bonding pads positioned on the edge of the active surface of a lower chip structure when the upper chip structure is stacked on the active surface of the lower chip structure with the pedestals.