发明名称 |
Leadframe package with dual lead configurations |
摘要 |
The invention provides a variety of leadframe packages in which signal connections and fixed voltage connections are configured differently to improve the relative performance of the connections relative to their assigned function. The signal connections incorporate one or more configurations of signal lead and corresponding signal bonding wires that tend to reduce the relative capacitance of the signal connectors and thereby improve high speed performance. The fixed voltage connections incorporate configurations of fixed voltage leads and fixed voltage bonding wires that will tend to reduce the inductance of the fixed voltage connector and reduce noise on the fixed voltage connections and improve power delivery characteristics. The configurations of the associated signal and fixed voltage connections will tend to result in signal connections that include signal leads that are shorter, narrower and/or more widely separated from the active surface of the semiconductor chip than the corresponding fixed voltage leads.
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申请公布号 |
US2009230520(A1) |
申请公布日期 |
2009.09.17 |
申请号 |
US20090453863 |
申请日期 |
2009.05.26 |
申请人 |
LEE JONG-JOO;AHN MEE-HYUN |
发明人 |
LEE JONG-JOO;AHN MEE-HYUN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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