METHOD OF TREATING SURFACE OF COPPER AND METHOD OF TREATING SURFACE OF PRINTED WIRING BOARD

摘要

A method of treating a surface of a printed wiring board (10), in which cupric oxide (6) is formed on the surface of a copper foil (5) which is an outer layer of a laminate obtained by laminating copper foils (3) and (5) to base resins (1) and (4). The cupric oxide (6) is formed by subjecting the printed wiring board (10) to electrolytic anodizing in an alkaline aqueous solution (30) containing copper oxide ions in a concentration of from 0.001 [mol/L] to a saturation concentration. In this anodizing, a 2-6 [mol/L] sodium hydroxide or potassium hydroxide solution having a temperature of 50-90°C is used as an electrolytic solution. The thickness of the cupric oxide is regulated to 0.6-3.0 µm.