发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress a damage to the edge of a first gate insulation film. SOLUTION: The device includes a substrate, a first gate insulation film formed on the substrate, a charge storage layer formed on the first gate insulation film, a second gate insulation film formed on the charge storage layer, and a gate electrode formed on the second gate insulation film. The width between side surfaces of the second gate insulation film is smaller than the width between side surfaces of the gate electrode. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009212216(A) 申请公布日期 2009.09.17
申请号 JP20080052167 申请日期 2008.03.03
申请人 TOSHIBA CORP 发明人 TAKEUCHI WAKAKO;AKAHORI HIROSHI;KONDO MASAKI
分类号 H01L21/8247;H01L27/115;H01L29/423;H01L29/49;H01L29/788;H01L29/792 主分类号 H01L21/8247
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