| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which eliminates the need to form a through via, makes a package small in thickness and compact, has heat dissipation enhanced, and prevents a metal thin wire from short-circuiting, and to provide a method of manufacturing the same. <P>SOLUTION: A head peak portion of the metal thin wire connecting a pad 4 of a semiconductor element 2 to a first wiring pattern 5 is connected electrically and directly to a second wiring pattern 11 disposed above the metal thin wire 3 through a conductive adhesive 12. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
