| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board for accommodating electronic chips, that is favorable in the forming accuracy of square holes (cavities) for accommodating the electronic chips, excels in workability at the time of punching or embossing the square holes, and is hardly causes troubles of foreign material adhesion such as implementation mistakes and paper powder generation at the time of implementing the electronic chips in a mounter. SOLUTION: The mounting board for accommodating the electronic chips is formed with concave parts or holes for accommodating the electronic chips. The other part other than the surface layer of the mounting board is separated and released by a separation and releasing method of pulp of JIS P 8220. A rate of micro fibers smaller than 0.20 mm is 20% or greater in a fiber length distribution at the time of calculating an average number of a fiber length measured by a pulp fiber length test method of an optical automatic measuring method defined in JAPAN TAPPI No. 52. COPYRIGHT: (C)2009,JPO&INPIT
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