SEMICONDUCTOR DEVICE, AND COMMUNICATION APPARATUS AND ELECTRONIC APPARATUS PROVIDED WITH SEMICONDUCTOR DEVICE

摘要

Provided is a package structure with further reduced planar size for a semiconductor device. The semiconductor device is provided with a first package (2) wherein a first element (1) is stored, and a second package (4) which is fixed over the first package, with a second element (3) stored therein. The first package (2) includes a lead frame (5) and a wiring pattern (6), and the wiring pattern (6) is formed by using a transfer lead frame wherein the wiring pattern (6) is arranged on a base material when a resin is molded, leaving the wiring pattern (6) on a peeling surface of the molded resin as transferred thereto by peeling the base material after the resin is molded, and permitting an end portion of the wiring pattern (6) to expose to face the peeling surface side of the molded resin as an external terminal (6a). The first element (1) is mounted to partially overlap the external terminal (6a) of the wiring pattern (6) with an insulating layer (8) in between, and the first element is electrically connected with the lead frame (5) and the wiring pattern (6).