发明名称 CIRCUIT SUBSTRATE
摘要 A circuit board is provided to reduce electromagnetic interference and the distortion of a first signal by forming a return current path in a second penetration electrode. A board body(10) has a first side, a second side and a via hole. The via hole passes through the first side and the second side. A dual via structure(20) has a first penetration electrode and a second penetration electrode. The first and second penetration electrodes are arranged in an inner side of the board body formed by the via hole. The first and second penetration electrodes are electrically insulated. A first wiring(30) is electrically connected to the first penetration electrode. A second wiring(40) is electrically connected to the second penetration electrode. A first signal is applied to the first wiring. A second signal is applied to the second wiring. The first signal is a data signal. The second signal is a ground signal.
申请公布号 KR20090098077(A) 申请公布日期 2009.09.17
申请号 KR20080023254 申请日期 2008.03.13
申请人 HYNIX SEMICONDUCTOR INC. 发明人 PARK, JEONG HYUN
分类号 H05K1/11 主分类号 H05K1/11
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