| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer capable of preventing the generation of damage or coming-off of a semiconductor chip and abnormal operation due to warpage of a wiring board and a semiconductor chip caused by mismatching between coefficients of linear expansion, in mounting the semiconductor chip on a wiring board via an interposer by an FC method, and then sealing it with an underfill material. SOLUTION: The interposer has a base made of an inorganic material having thermal resistance and insulation property, and conductor embedding through holes piercing the base and each being filled with a conductor in its piercing portion. The base is so constituted that it has a cross-sectional shape moved in a widthwise direction so that deformation caused in an electronic device manufacturing process can be compensated. COPYRIGHT: (C)2005,JPO&NCIPI |
