| 摘要 |
A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) having a wiring pattern(13) and a cover body(5) having an opening(14). The wiring pattern is formed on the base body. A light emitting diode device(3) is mounted on the wiring pattern. The light emitting diode device is mounted in the opening of the cover body. The base body and the cover body are attached to each other. A method for manufacturing the package includes a process for attaching a base plate having wiring patterns on a cover plate having a plurality of openings. The method further includes a process for dividing the base plate and the cover plate according to each of packages. |
