| 摘要 |
Imager devices configured for back side illumination include a structural support member surrounding a sensor array. A conductive element for communicating electrically with the sensor array may be provided on a front side of the sensor array. In some embodiments, a plurality of conductive elements may be provided on the front side of the sensor array, and each conductive element may be vertically aligned with the structural support member. Imaging systems include such imager devices. Methods of forming an imager device are also disclosed.
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