| 发明名称 |
THE LASER DISING SHEET AND METHOD FOR MANUFACTURING CHIP BODY |
| 摘要 |
<p>The present invention aims to prevent cutting of a dicing sheet, damage to a chuck table and fusion bonding of a dicing sheet to a chuck table by laser light during laser dicing. Specifically disclosed is a laser dicing sheet which is characterized by being composed of a base made of a polyurethane acrylate and an adhesive layer formed on one side of the base.</p> |
| 申请公布号 |
KR20090096439(A) |
申请公布日期 |
2009.09.10 |
| 申请号 |
KR20097011527 |
申请日期 |
2007.11.29 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
WAKAYAMA YOJI;SATO YOSUKE;TAYA NAOKI |
| 分类号 |
H01L21/301;C09J7/02;C09J201/00 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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