| 摘要 |
<p>A semiconductor package is provided to the up, down, left, right stress of the semiconductor package by sealing the upper part of a sealing agent protruded from a bonding wire loop. In a semiconductor package, a semiconductor chip(108) is adhered on a substrate(102). A bonding wire(107) electrically connects the semiconductor chip and the substrate. The sealing agent(114) has a protrusion(112) in which the part corresponding to the bonding wire is protruded to the upper. The protrusion of the sealing agent is made of a photo frame shape, and the sealing agent has a thickness of 100~150um at a region excluding the protrusion.</p> |
