| 摘要 |
PROBLEM TO BE SOLVED: To provide a pickup method for a thin type chip with a die attach film in which the chip can be picked up at high speed without any damage. SOLUTION: In the pickup method for the chip in which the plate type chip having the die attach film stuck on its reverse surface is picked up from a sheet together with the die attach film, the die attach film 7 is cooled and cured by circulating a cooling medium to a cooling medium circulation groove 23d provided to the suction portion 23 of an ejector mechanism 8 prior to a pickup operation for sucking and holding and taking the chip out through a taking-out nozzle, and the die attach film 7 which has been cured to have larger rigidity is thrust up from below the sheet 5 by the ejector pin 24 of the ejector mechanism 8 together with the chip 6, so that the chip 6 is stably peeled off the sheet 5 without being damaged. COPYRIGHT: (C)2009,JPO&INPIT
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