| 摘要 |
<p>A method of manufacturing an electronics substrate intended for use in power electronics is disclosed. The method is characterised by using a sand- blasting operation to erode the electronics substrate, the sand-blasting operation being characterised by use of particles entrained in a stream of fluid under pressure to pass through a nozzle before impacting the electronics substrate. The particles used in the sand blasting operation have a hardness of at least 6 on the Mohs scale of hardness, and a particle size of in the range of from about 28μm to about 2800μm.</p> |
