METHOD FOR CLEANING THIN FILM FORMING APPARATUS, THIN FILM FORMING METHOD, AND THIN FILM FORMING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for cleaning a thin film forming apparatus, a thin film forming method and a thin film forming apparatus, that can suppress particle generation and improve productivity.

SOLUTION: A control part 100 of a heat treatment apparatus 1 executes more than once a film forming process of forming a thin film by supplying a film forming gas containing hexachlorodisilane and ammonia to semiconductor wafers W. The control part 100 further executes a cleaning process of cleaning the interior of the heat treatment apparatus 1 by supplying a cleaning gas into a reaction tube 2 before executing the process in which the cumulative film thickness of silicon nitride films formed on semiconductor wafers W by the film forming process exceeds 1.5μm.

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