| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a damping material for electronic device components, which generates less outgassing. <P>SOLUTION: Low rebound-resilience polyurethane foam formed by using a silicon-based surface-active agent having a reactive amine catalyst, and an active hydrogen group in its structural end is shaped by being thermally compressed. As a result, a damping material for electronic device components can be obtained which is excellent in damping performance and generates a silicon compound of 0.5μg/g or less and a total VOC amount of 300μg/g or less and further generates an extremely small amount of the outgassing. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
