发明名称 BONDING APPARATUS
摘要 Bonding apparatus (10) for bonding a thermoplastic first material (12) to a second material (14) includes a heater arrangement (22) for heating a bonding surface (16) of the first material (12) to melt the bonding surface (16) and moving means (30) for moving the first and second materials (12, 14) together to a bonded condition.
申请公布号 WO2009103981(A1) 申请公布日期 2009.08.27
申请号 WO2009GB00459 申请日期 2009.02.19
申请人 EPL COMPOSITE SOLUTIONS LTD;CHAMBERS, DAVID, RONALD, ALFRED;FINNEY, NIGEL, ANDREW;WARD, STUART;TURNER, MATTHEW, RICHARD 发明人 CHAMBERS, DAVID, RONALD, ALFRED;FINNEY, NIGEL, ANDREW;WARD, STUART;TURNER, MATTHEW, RICHARD
分类号 B29C65/14;B29C63/00;B29D24/00;B29K23/00 主分类号 B29C65/14
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