<p>A chip fuse that not restricted in the degree of freedom of fusing characteristics, realizes prevention of shortening of fusing time at large magnification with respect to rated current and attainment of shortening of fusing time at small magnification with respect to rated current. A chip fuse (10) has a first heat storage layer (12) of film material with low thermal conductivity superimposed on an insulating substrate (11) and has a fuse film (13) superimposed on the first heat storage layer (12) so as to avoid contact with the insulating substrate (11). The fuse film (13) has a fuse element part (13b) interposed between surface electrode parts (13a) disposed at both edges thereof. A second heat storage layer (15) of film material with low thermal conductivity is superimposed on the fuse element part (13b). The first heat storage layer (12) is thicker than the second heat storage layer (15). The first heat storage layer (12) and second heat storage layer (15) are those produced from a sheet material of B-stage state containing a photosensitive group.</p>
申请公布号
WO2009104279(A1)
申请公布日期
2009.08.27
申请号
WO2008JP53550
申请日期
2008.02.28
申请人
KAMAYA ELECTRIC CO., LTD.;YAMAGISHI, KATSUYA;SEINO, HIDEKI;SATO, HITOSHI