| 摘要 |
<p>Provided is a resin composition for sealing an optical device that has favorable curability, exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and yields a cured product that enables an improvement in the light extraction efficiency from a semiconductor light emitting element at a high refractive index. The above resin composition for sealing an optical device comprises:
(A) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3 × 10 3 , represented by an average composition formula:
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 1 a (OX) b SiO (4-a-b) /2
(wherein, each R 1 represents, independently, an alkyl group of 1 to 6 carbon atoms, an alkenyl group of 2 to 6 carbon atoms, or an aryl group of 6 to 10 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.00 to 1.5, and b represents a number that satisfies 0 < b < 2, provided that 1.00 < a+b < 2),
(B) an aluminum chelate compound, and
(C) fine particles of a metal oxide sol.</p> |
